High Efficiency Heat Sink

Diodes, transistors and other electronic components generate the heat during working period, the continual heat accumulation can overheat the devices and damage or profoundly impact the performance of the applications. As the semiconductor power keeps growing, the high efficiency heat sink is necessary  to cool down the applications and maintain the temperature within the max operating temperature. Unlike the one solid single heat sink which is extruded or skived from a metal bar, high performance heat sink usually is a combination of various thermal components which can completely take the advantages of each material properties. Sinda Thermal can supply a range of high efficiency heat sinks such as heat pipes heat sink, vapor chamber heat sink, liquid cooling cold plate, etc.

How to build a high efficiency heat sink?

Heat sinks are designed for cooling the electronic devices to protect the components from overheating, how to build a high efficiency heat sink for the applications? there are several elements need to be considered.

1, Thermal resistance

Thermal resistance reflects the resistances summary of heat flow between heat source and cooling medium. Although the thermal resistance valume is a simulation, but it direct the heat sink design and provide the analysis of thermal properties of applications, which determines the heat sink geometries and layout to optimize the performance.

2, Material

Heat sink materials usually have excellent thermal conductivity and production feasibility such as aluminum and copper, these two kinds of materials are the most widely used thermal materials, as they have great thermal conductivity and can be mass produced, also the cost is acceptable.

3, The fin density and allocation

The medium flow is significantly influenced by the fins configuration, optimizing the fins construction can reduce the fluid flow resistance and allow more fluid flow to get through the heat sink, and the performance will be improved.

4, Thermal interface material

The surface dents roughness, and gaps will prevent the heat sink contact surface and device fitting completely and increase the thermal resistance, to solve this problem, thermal interface material is a essential components.

5, Heat sink attachment methods

The heat sink performance can be improved when choosing a appropriate installation method of heat sink to electronic device, this attachment process should be considered in both thermal and machanical requirements of thermal solution.

Product images

Packing and delivery

FAQ

Q: Are all the heat sinks manufactured in house?

A: Yes, we are a manufacturer and we own a factory.

Q: Can you provide some samples for testing? for fee or need to be paid?

A: For some standard heat sinks, we can provide some samples if we have stock, but custom samples need to be charged.

Q：What's the lead time of the products?

A: for prototype orders, the lead time is usually 1-2 weeks, for production order, the lead time is 4-6 weeks, it can be negotiated.

Q: Can I visit your plant?

A: Yes, welcome, you can also visit our plant on line by the VR.

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