What is the role of thermally conductive silicon film in helping power electronics to dissipate heat?

          Thermally conductive silicon film is a high-performance elastic insulating material with a special film as the base material. It is mainly installed in the gap between the heating interface and its components to act as a heat-conducting medium. 

          Power electronics is composed of multiple components such as power supply main chip, transformer, MOS tube, PCB board, resistance and capacitor, and it emits a lot of heat during operation, so it is necessary to select the corresponding thermal interface material for heat conduction and reduce heat. To maintain the normal operation of the product.

          The transformer will generate a lot of heat at the same time as the electric energy is converted. At the same time, these components are installed on the PCB board in the form of plug-ins. Some choose to use thermal silica film between the PCB board and the shell to dissipate heat, and some use thermal conductive silica film. Conduct the temperature of the components to the radiator. Although the thermal conductivity material selected is different, the goal is always to lower the temperature of the heat source.

          In addition to the main chip of the power supply, the MOS tube is a component that generates a large amount of heat. If the MOS tube has a poor heat dissipation effect, an excessively high temperature may cause the MOS tube to burn out, which may cause the entire circuit board to be damaged, so its heat dissipation is relatively high. According to the requirements, the traditional heat dissipation solution is thermal silicon film + thermal grease application. 

          At present, you can also choose to use ultra-thin high thermal conductivity insulating sheet to isolate and then use thermal grease to dissipate heat, so that in addition to heat dissipation, it can also prevent static electricity damage.