Intel 2U Standard Heatsink

 Product Description：

   This heatsink design is optimized for Intel® Xeon® Scalable Processors thermal solutions , it contains aluminum die casting base, aluminum stamping zipper fin , copper block, and 4 heat pipes to support 205W TDP applications.

   We use zipper fin stack soldered, brazed, or epoxied to a heat sink base or a series of heat pipes to create a comprehensive thermal management assembly. As zipper fins are joined together on both the top and bottom of the fins, they offer higher mechanical stability compared to other fin types such as skived or folded fins.

Features and Benefits:

1. Maximum Performance by using high density fin fabrication to increased surface area.

2. Thin fin geometry lowers pressure drop, improves system airflow,and reduces fan costs.

3. Designed to meet all Intel standards and requirements,including mounting hardware, stiffness, and performance.

4. Pre‐assembled with captive mounting hardware and ready for installation with instruction label

5. Precise surface flatness and high performance thermal grease ensure minimum interface resistance

Specifications:

Detailed Picture:

Drawings & Thermal Spec:

FAQ:

Q: Are you trading company or factory?

A: We’re factory professional in providing ODM/OEM service, Sinda Thermal can provide 

    one-stop service including design ,manufacture, testing to meet customer’s requirement.

Q: What’s the payment term?

A: T/T in advance for new customer, and for long-term business,this can be negotiated.

Q: Any tooling cost required of my product ?

A: No tooling cost is needed for soft tooling sample build , 

    but for hard tooling for mass production ,tooling cost will need to covered in the new orders.

Q: Can I add labels on product which can be tracked in the future?

A: Yes, we can add PPID label on your product based on your format.

Q: Do your provide samples for verifications?

A: Yes ,we can provide free sample to you for testing verification before mass production.

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