What's The Difference of heatpipe and vapor chamber
With the rapid development of electronic products, consumers have higher and higher requirements for the performance of electronic products, such as mobile phones, charging power, performance improvement and thickness become thinner, which makes the heat thermal design of mobile phones more and more complex. Conventional graphite fin heat dissipation can not meet the requirement, so more and more new thermal solution have been put into use, such as mobile phone heat pipe, ultra-thin VC and so on.
At present, the manufacturing process of ultra-thin heat pipe for mobile phone is familiar with ordinary heat pipe, but the copper powder sintering with capillary structure has been replaced by sintered copper mesh to adapt to the flattening thickness below 0.4mm. Ultra thin VC adopts etching + brazing or diffusion welding process. Products with thickness of 0.4mm, 0.35mm and 0.30mm have been widely used.
Application difference between heat pipe and VC:
On 5g smart phones, the heat pipe and VC are generally bonded through the thermal interface material Tim, the cold end is in contact with the mobile phone heat source, and the hot end is in contact with the body alloy material. Through the rapid evaporation and condensation process of phase change filling working medium, the heat is quickly diffused to the body alloy frame, and dissipated through natural air convection and radiation. At present, the antipyretic effect of ultra-thin VC can reach 12 ~ 15W, while that of ultra-thin tube is 5 ~ 6W.
The shape of the ultra-thin heat pipe is a one-dimensional plane, and the effective length is limited by the thickness and the internal structure of the mobile phone. Compared with the heat pipe, the advantage of vapor chamber is that the shape restriction is small. It can refer to the hardware layout of the mobile phone and flexibly fit the design. The contact surface of the cold end can be large and all cover the heat source chip. The overall width and length can also be enlarged, and there is no problem with abnormal shape and segment difference structure.
