Why does 5G require higher thermal performance from electronic devices?

    With the arrival of the 5G era, electronic device product design is developing towards lightness, intelligence, and multifunctionality. The arrival of the 5G era requires electronic device products to have more intelligent functions. With the arrival of the 5G era, electronic device products need to transmit more data information at once, the transmission speed needs to be faster, the heat generation needs to be increased, and the requirements for device heat dissipation performance are also higher.

   Thermal conductive materials are a new type of industrial material designed for better transmission and export of heat in equipment. They need to have appropriate countermeasures for possible thermal conductivity problems in equipment, so as to provide strong assistance for highly integrated and ultra small and ultra-thin equipment, so as not to cause unnecessary losses to users due to short circuits or even self ignition caused by high temperature. Nowadays, thermal conductivity products have been increasingly applied to many electronic products, improving their reliability.

    For electronic equipment products, the thermal conductivity of thermal insulation sheets directly affects the reliability, user experience, and other performance of electronic equipment products. The higher its reliability, the longer the fault free working time, thereby improving product competitiveness and enhancing user experience.

    Thermal conductive materials are mainly used to solve the thermal management problems of electronic equipment products. The heat generated during operation will directly affect the performance and reliability of electronic products. Experiments have proven that for every 20 degrees increase in temperature of electronic components, reliability decreases by 10%; The lifespan at a temperature rise of 50 degrees is only 1/6 of that at a temperature rise of 25 degrees. As the volume of integrated circuit chips and electronic components continues to shrink, their power density rapidly increases, and heat dissipation has become a problem that electronic devices need to solve.

    Therefore, in the 5G era today, the requirement for thermal conductivity in electronic devices has become very important, and the thermal conductivity of a device is directly linked to the competitiveness of the product.