Why does the thermal grease is needed to cooling down the chips
Thermal conductive grease is a soft substance that fills the gaps between electronic products. Nowadays, many high-end fans have already been coated with thermal conductive silicone grease at the bottom, which is dry and different from the commonly used paste and emulsion liquid silicone grease. It has a good thermal conductivity and a mixture of high-purity fillers and organic silicon. It is generally used on the assembly surface of semiconductor devices and heat sinks, eliminating air on the contact surface, increasing heat flow channels, and improving heat.
When installing a heat sink, it is best to apply thermal conductive paste between the heat sink and the CPU. The function of thermal conductive paste is not only to quickly and evenly transfer the heat generated by the CPU to the heat sink, but also to increase the thermal contact between the uneven lower surface of the heat sink and the CPU. Moreover, the thermal conductive paste has a certain degree of viscosity. In the case of slight aging and loosening of the metal elastic plates that fix the heat sink, To a certain extent, it can prevent the heat sink from separating from the surface of the CPU and maintain its heat dissipation function.
Characteristics of thermal conductive silicone grease:
Thermal conductive silicone grease is a new type of organic grease designed for heat transfer in electronic components. It is produced using a special formula and is composed of metal oxides with good thermal conductivity and insulation properties and organic siloxanes.
1. Good thermal conductivity and electrical insulation, shock absorption, and impact resistance
2. 0.05 ℃ in ²/ W thermal resistance
3. A type of adhesive similar to thermal conductive interface material that does not dry out
4. For heat conducting chemicals, it can maximize the heat conduction between semiconductor blocks and heat sinks
5. Good electrical insulation will not harden even after prolonged exposure to high temperature environments
6. Environmentally friendly and non-toxic
No heat dissipation is a relative concept, not no heat dissipation, which requires the gradual development and transformation of thermal conductive material technology and processes. No heat dissipation is not a gimmick or unattainable, but it does require industry efforts to explore and integrate resources. It is not difficult to imagine that achieving no heat dissipation will overturn traditional heat dissipation solutions.
