Intel LGA1700 Server CPU Heatsink
This CPU heatsink is designed for 4U servers equipped with Intel LGA1700 CPU socket,the CPU heatsink is composed of aluminum tower fin stack, copper base and 6 heat pipes,which is a high performance thermal solution for high power CPU devices.The heat sink has been fully tested and inspected by Sinda Thermal to ensure the best quality and thermal performance.
Product Introduction
This CPU heatsink is designed for 4U servers equipped with Intel LGA1700 CPU socket,the CPU heatsink is composed of aluminum tower fin stack, copper base and 6 heat pipes,which is a high performance thermal solution for high power CPU devices.The heat sink has been fully tested and inspected by Sinda Thermal to ensure the best quality and thermal performance. If you want to learn more about LGA1700 server CPU heatsink, please contact us freely.
Product specifications
| Components | Aluminum fin+copper base+6 heat pipes | Manufacturing process | Stamping, CNC, soldering |
| CPU socket type | LGA1700 | Surface finish | Nickel plating, passivation |
| Product dimensions | 94mm*94mm*134mm | Server form factor | 4U |
| Fin thickness | 0.4mm | Environmental Compliance | RoHS and REACH compliant |
| Fin Pitch | 2.4mm | Cooling type | Passive |
| Supported CPU TDP | 280W | Warranty | 1 year |
| CPU hole center distance | 78*78mm | Application | LGA1700 CPU socket |
Product details
Aluminum zipper fin stack
The aluminum zipper fin stack is stamped from aluminum sheet indiviually. Firstly, Utilizing a punch tooling to create the geometry of the fin. Length, height and fin pitch are determined in the first set of punches. The fin thickness is determined by the thickness of the aluminum sheet. In the process of Stamping, the fin is interlocked with the previous fin. When the fin stack has enough fins for the length, it will be removed from the punching area. As the aluminum could not solder with heat pipes or other metal directly, we have to implement surface finish for the fin stack, typically the surface finish is nickel plating, which not only can make the aluminum fin stack solderable, but also has beautiful appearance, and then we soldered it with a copper base and heat pipes to form a zipper fin heat sink. Zipper fin stack also can be designed with high aspect ratio fin heat sink profiles, enabling taller, thinner and denser fins to improved cooling performance. so zipper fin heat sink is also called high performance heat sink.
Heat pipes
Heat pipe is a two phase heat transfer device, which is a very high effective thermal conductor, heat pipe consists of vaccum copper tube, working fluid, and a wick structure, when the heat pipes contact the heat source, the heat vaporizes the liquid working fluid and the vapor absorb the heat and move to the condenser end by the pressure, in the condenser end, the hot vapor condenses to liquid and release the latent heat, the liquid flows back to the vaporazation by the capillary force of wick structure, The phase change processes and two-phase flow circulation continue as long as the temperature gradient between the evaporator and condenser are maintained.
Recommended products
Thermal design capability
Factory and workshop
Certificates
FAQ
Q: what's the minimum quantity for placing an order?
A: No MOQ setting up, small orders are acceptable.
Q: How many days the copper skiving fin heat sink will be shipped since I release an order?
A: The lead time based on the quantity, usually is 2-4 weeks.
Q: What's your payment term?
A: For small orders, the payment should be fully paid before manufacturing, for mass production order, 30% deposite need to be paid, and the balance need to be completed before shipping.
Q: Can you provide samples for testing?
A: Yes, we can provide samples form testing, but for custom samples, they should be paid.
Hot Tags: intel lga1700 server cpu heatsink, China, manufacturers, customized, wholesale, buy, bulk, quotation, low price, in stock, free sample, made in China
You Might Also Like
Send Inquiry
