20pcs Copper Vapor Chamber CPU Heatsink Will Be Ready Soon
Apr 24, 2023
Today, Sinda Thermal production team finished and shipped out the 20 pcs coppr vapor chamber heatsinks for US customer. This heatsink contains a copper vapor chamber and a copper stamping zipper fin, they are assembled together by reflow soldering process. The heatsink module is for server CPU cooling applications, and the design TDP is 250W . Thanks for the order, we will arrange the shipment to customer site by tomorrow.
Vapor Chambers, which work familar with heatpipe principles, offer improved spreading efficiency, higher thermal conductivity, and reduced weight for CPUs, GPUs, and high performance telecom device.
