30pcs Telecom Device Copper Vapor Chamber Heatsink Samples Shipped

      Recently , Sinda Thermal production team is working on the sample build of the 30 pcs copper vapor chamber cooling heatsink. It is for 5G telecom device cooling application,the heatsink contains a copper vapor chamber and copper stamping zipper fin, they are assembled together by reflow soldering process.

       Vapor Chambers, which work familiar with heatpipe principles, offer improved spreading efficiency, higher thermal conductivity, and reduced weight for CPUs, GPUs, and high performance telecom device.