
Tower CPU Heatsink
Tower heatsik has highdensity fins, and the heat dissipation effect can also meet the needs of most players. It is also the mainstream product occupying the market at present
Product Introduction
Product Description:
CPU heatisnk transfers heat to the cooling fins of the heatsink through thermal grease, copper pipe, base and other heat conducting media, and then uses the fan to blow away the heat. From the working principle, what can affect the heat dissipation effect is the heat conduction effect of the heat conduction medium and the size ,speed of the cooling fan.
As the name suggests, the tower heatsink is like a high tower standing on the motherboard. The cooling fins and fans are often larger than the down pressing type, and the cooling effect is better. Moreover, the wind is one-way side blowing, which will not affect the air duct of the chassis. However, it can not take into account the heat dissipation of the motherboard and memory module, and you must pay attention to its size when buying to see if it will block your memory module.
Working Principle :
The CPU transfers the heat to the tower radiator base through the thermal grease. There is liquid in the heat transfer copper pipe, which disperses the heat in the heat transfer base and transfers it to the cooling fins. Finally, the fan blows away the heat on the cooling fins. Such continuous circulation provides good heat dissipation performance for the tower radiator.
Why use tower heatsink:
1. Flat and smooth base, heatpipe can be designed to contact with chips directly, which provide most effective thermal performance.
2. The tower heatsink is easier to form a cooling air duct with other fans in the chassis. Under the condition of good workmanship, the cooling efficiency is high, which is suitable for medium and high-end computer platforms.
3. In addition to cooling the CPU, the tower radiator can also take part of the heat away from other heating parts inside the chassis.
4. Combines both the advantages of heatpipes and fan in thermal performance.
Specification Details:
Material: copper , aluminum
Surface Treatment: nickel plated, anoding,etc
Process: Stamping, CNC machining , through fin assembly, reflow soldering
Power Supply: 165W to 350W
HeatPipe quantity: 2-6pcs
Size: Customized
Fan Speed: 2500RPM±10%
Fan Life: 40000+hours
Platform: Intel/AMD full platform processors
Product Exhibitions:


Why Choose Us:
1. Fast respond, all quotation or inquiry will be finished within 24 hours.
2. Cost effective support , we have our own factory to provide the lowest
production cost to support customer with competitive price.
3. Experienced engineering team.
4. High capacity factory manufacture ability.
5. Complete quality control system to ensure stable quality output.
About us:
Sinda Thermal is specialized in design of thermal simulation, customized various heat sinks, liquid cooling plates and relative machining parts, which contains extrusion,CNC machining , stamping, skived fin , reflow soldering and vacuum brazing , friction stir welding process etc ; products are widely used in server, data center,new energy batteries, new energy vehicles, communication equipment, household appliances,medical equipment, military industry and other fields.
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