5000pcs Micro Stamping Heatsink Demand From Japan Customer

     Today,  Sinda Thermal team received the hard tooling process notice for the first 5000pcs mass production of micro stamping heatsink.  The heatsink material is aluminum with black anodized surface treatment.  Thanks again for the great support , we will start the hard tooling process immediately,and the first 5K order will delivered in 4 weeks.

     Micro thin stamping cooling heatsink is a product specializing in low-power device cooling applications. It has high-strength pressure-sensitive thermal conductive adhesive, which can be easily adhered to the device (or heat source).This design provides an effective method for cooling IC devices with high cost effective, which is suitable for those occasions where the space of electronic products is limited and the traditional radiator cannot be used, so it improves the long-term reliability of the devices.