Vapor Chamber Cooling
As the continuous improvement of chip power density, vapor chamber has been widely used in the cooling of high-power devices such as CPU, NP, and ASIC. Although vapor chamber can be considered a flat heat pipe, it still has some core advantages. It has better temperature equalization effect than metal or heat pipe. and it can make the surface temperature more uniform (reduce hot spots). Secondly, the use of vapor chamber radiators can allow direct contact between the heat source and the device, thereby reducing the thermal resistance; while the heat pipe usually needs to be embedded into the base.
Product Introduction
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The vapor chamber is a flat plate-like object in appearance, with two copper covers on the upper and lower sides which are closed to each other, and supported by copper pillars inside. The upper and lower copper sheets on the vapor chamber are made of oxygen-free copper, usually pure water as the working fluid, and the capillary structure is made of copper powder sintering or copper mesh. As long as the vapor chamber maintains its flat characteristics, there is no restriction on the shape, and there is no limitation on the placement angle during using.
In practical application, the temperature gap measured at any two points on the plate can be less than 10°C, which is more uniform than the heat pipe conducting the heat from the heat source. The thermal resistance of a common vapor chamber is 0.25°C/W, and it is used at 0°C to 100°C.
The vapor chamber is a vacuum cavity with a microstructure on the inner wall. When the heat is conducted from the heat source to the evaporation area, the cooling liquid in the cavity is heated in a low vacuum environment and begins to vaporize the cooling liquid. Absorbs heat energy and expands rapidly in volume, and the cooling medium in the gas phase quickly fills the entire cavity. When the gas phase working medium contacts a relatively cold area, condensation will occur, and the heat accumulated during evaporation will be released through the condensation phenomenon. The condensed cooling liquid will return to the evaporative heat source through the capillary channel of the microstructure, and this operation will be repeated around the cavity.
The working principle of the vapor chamber is similar to that of the heat pipe. The evaporation and condensation of the liquid in the operation plate will take away the heat and complete a fully heat dissipation process. The vaporization of the liquid in the vapor chamber continues, and the pressure in the chamber will maintain equilibrium as the temperature changes. The thermal conductivity of the liquid is low when it operates at low temperature, but because the viscosity of the liquid changes with the temperature difference, the vapor chamber can also operate at 5°C or 10°C.
Product specification
Dimenison | 106*82*3.0mm |
Holes location | 94*56mm |
Hole dimenison | Φ5.2mm |
Power | 150W |
Weight | 131.454g |
Material | C1020 |
Tips: all the specification and surface finish can be customized.
The advantages of vapor chamber
The thermal performance of vapor chamber is much better than heat pipe although the VC is considered as a flat heat pipe, vapor chamber still has plenty of advantages:
Vapor chamber has a better temperature equalization effect than heat pipe;
Vapor chamber can contact the heat source directly to reduce the thermal resistance;
Vapor chamber can solve high power devices thermal issues with smaller volume.
Our factory abilities
Sinda Thermal has a very professional engineering team to design and evaluate the vapor chamber build, we own over 30 stamping machines so we can manufacture the top cover and bottom base in house, and we have two soldering line that the vapor chamber cooling module can be soldered in house, aslo we have adequate testing equipment, over 100 employees to meet various demand. Please feel free to contact us if you have any thermal concerns.
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