5G Overlay AI Drives The Demand For Cooling in The Mobile Phone Industry

     Smartphones contain many components that generate heat, as well as many components that are prone to performance and lifespan being affected by heat. Without effective heat dissipation, the heat generated during device operation will directly affect the performance and reliability of electronic products. There is experimental evidence that for every 2 ℃ increase in temperature of electronic components, reliability will decrease by 10%, and the lifespan of a 50 ℃ temperature rise is only 1/6 of a 25 ℃ temperature rise. Therefore, it is crucial to efficiently use thermal conductive materials and devices to solve heat dissipation problems.

    With the arrival of the 5G era and the emergence of 5G smartphones, the demand for heat dissipation materials and devices in the mobile phone industry has significantly increased. The reason is that the computing power of 5G chips is at least 5 times higher than that of 4G chips, and the power consumption is about 2.5 times higher. Therefore, stronger thermal conductive materials and devices are needed. In the 5G era, more efficient liquid cooled heat pipes, heat plates, and other liquid cooled cooling methods have gradually replaced graphite and other cooling methods as the mainstream cooling form for smartphones, while graphite cooling has become an auxiliary.