AI Smartphones Have A Significant Demand For Thermal Products

     The rapid increase in computing power and power consumption of mobile phones has made cooling the key to ensuring stable operation of mobile phones. High performance AI chips generate a large amount of heat during operation. If they cannot dissipate heat in a timely and effective manner, it will not only restrict AI computing power, but also affect the stable operation of equipment and shorten its service life. Related experiments have shown that for every 2 ℃ increase in temperature of electronic components, reliability will decrease by 10%, and the lifespan of a 50 ℃ temperature rise is only 1/6 of a 25 ℃ temperature rise.
     According to IDC's forecast, the global shipment of next-generation AI smartphones will reach 170 million units in 2024, accounting for 15% of the overall smartphone shipment. Correspondingly, according to Counterpoint data, the overall AI computing power of generative AI mobile phones will reach over 50000 EOPS and power consumption will exceed 1000W by 2027. High value heat dissipation solutions such as graphene and vapor chamber will also accelerate penetration. According to NTCysd, the global average VC product market is expected to reach $2.079 billion by 2030, with a compound industry growth rate of 13.52%.