The World's First Solid-state Active Cooling AirJet

   In recent years, high-end hardware performance has exploded, and power consumption has also exploded simultaneously. This is true for both high-performance computing and smartphones, and heat dissipation has become the most challenging problem. There are various types of air-cooled liquid cooling, various materials and processes, but either the thermal efficiency is not high enough, the noise is too loud, or it takes up too much space.
   At the Taipei Computer Show, Far Systems unveiled the world's truly revolutionary solid-state active cooling technology, AirJet. The active cooling fins of the AirJet Mini have a thickness of only 2.8 millimeters, a length of 41.5 millimeters, a width of 27.5 millimeters, and a weight of only 9 grams, yet can carry up to 5.25 watts of heat with a back pressure of up to 1750 Pa. AirJet technology is leading a revolution in cooling technology, and it can be said that it can be used by any electronic device, especially in the era of AI where the demand for computing power is unprecedentedly strong. AirJet can provide excellent protection and maintain the high performance required for AI computing.