AirJet Mini Slim Fanless Heat Sink Appears CES 2024
Jan 12, 2024
Recently, Force Systems showcased a new AirJet active cooling chip solution at CES 2024, with a thickness of 2.8mm and a much higher cooling capacity per millimeter than traditional cooling methods.
AirJet Mini is designed specifically for fanless and lightweight laptops, capable of compressing power consumption by 5.25W with a power consumption of 1W; The AirJet Mini Slim launched this time is still 27.5mm x 41.5mm, but the thickness has been reduced by 0.3mm to 2.5mm; The weight has decreased by 1 gram to 8 grams.
