Copper Plate Aluminum Zipper Fin Heatsink
As the power of electronic devices growing, the electronic applications creates a ton of heat, if the heat could not be dissipated in time, the over-temperature enviroment will impact the performance of the electronic devices, eventually the electronics components would be damged, so heat sink act an essential role for the electronic development. The most common Heat sink material is aluminum and copper, both of the material has its own advantages: Comparing with copper, aluminum is more lightweight, cost-effective, better heat dissipation ability; But copper also has its own benefits, copper has much better thermal conductivity, it can absorb and transfer the heat much faster than aluminum.
Product Introduction
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Product Introduction
As the power of electronic devices growing, the electronic applications creates a ton of heat, if the heat could not be dissipated in time, the over-temperature enviroment will impact the performance of the electronic devices, eventually the electronics components would be damged, so heat sink act an essential role for the electronic development. The most common Heat sink material is aluminum and copper, both of the material has its own advantages:
Comparing with copper, aluminum is more lightweight, cost-effective, better heat dissipation ability; But copper also has its own benefits, copper has much better thermal conductivity, it can absorb and transfer the heat much faster than aluminum.
Due to the properties of the both metals, how can we take full advantage of the benefits of the two materials to design a high performance, lightweight, and cost-efficient heatsink? Copper aluminum heat sink is the answer. Usually we utilize the copper to build the plate to contact the heat source as its excellent thermal conductivity, the aluminum is commonly used to produce the zipper fins or folded fins as it has better heat dissipation efficiency.
Copper aluminum heat sink technology
The most commonly heat sink materials are copper and aluminum alloys. Aluminum alloy is easy to manufacture and low cost, so it is also the most widely used material. In contrast, the copper has better instantaneous heat absorption capacity than that of aluminum alloy, but the speed of heat dissipation is slower than that of aluminum alloy. Considering the respective shortcomings of copper and aluminum materials, some high-end heat sinks in the market are currently made of copper-aluminum combination. These heat sinks usually use copper metal bases, while the heat sink fins are made of aluminum alloys. Except for the copper base, There are also some other shapes such as copper pillars in heat sinks, which are also the same principle. With high thermal conductivity, the copper bottom surface can quickly absorb the heat released by the CPU; the aluminum fins can be made into the most favorable shape for heat dissipation by means of complex processes, and provide a large heat storage space and release it quickly. A balance has been found in all aspects.
Heat is dissipated from the CPU core to the surface of the heat sink, which is a heat conduction process. For the base of the heat sink, since it contact with a small area of high heat source directly, it requires the base can quickly conduct heat away. The use of materials with higher thermal conductivity for the heat sink is very helpful to improve the heat conduction efficiency. For example, the thermal conductivity of aluminum is 735KJ/(M.H.K), and the thermal conductivity of copper is 1386KJ/(M.H.K). Compared with a heat sink of the same volume, the weight of copper is 3 times than aluminum; Therefore, under the same volume, copper heat sinks can hold more heat than aluminum heat sinks and heat up more slowly. At the bottom of the same thickness, copper can not only quickly remove the temperature of the CPU die, but also its own temperature rise is slower than that of the aluminum heat sink. Therefore, copper is more suitable for making the bottom base of the heat sink.
Product Specification
| Heat sink type | Copper aluminum heat sink |
| Material | Copper plate, aluminum fins |
| Dimension | Custom |
| Cooling method | Passive cooling |
| Application | Server, LED, Telecommunication, UPS, inverter |
| Certificates | Rohs, ISO9000, ISO9001 |
| Delivery date | For samples, the lead time is 5-7 days, for mass production the lead time is 15-20 days |
| Package | Standard exporting packing, tray, carton and wooden pallet |
Our abilities
Thermal simulation
Packing and shipping
FAQ
Q: Are you trading company or manufacturer?
A: We are factory, and we are a leading manufacturer for heat sink over 7 years.
Q: How to get a quote? And how long it takes?
A: After receiving your customized drawings, then we can quote 1 to 2 days.
Q: Will drawing and project info be safe?
A: Sure, we can sign the NDA before sending drawings and promise the confidentiality.
Q: What is the MOQ?
A: No MOQ limit
Q5: Can you provide the samples
A5: Yes, but for the custom samples, the cost need to be paid by customer.
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