Application Of Heat Dissipation Design in Smart Phone

    Heat dissipation not only solves the problem of temperature, but also causes a series of problems, such as material aging, device  function, frequency reduction, reduced reliability of mobile phones, component damage and so on. Major manufacturers are making efforts to design their own mobile phone cooling system to optimize mobile phone performance and user experience.

   ZTE 5G use ICE3.0 Dual multidimensional thermal solution for better thermal conductive performance,  High performance heat conducting gerase is adopted between the middle frame and the main board, the main board and Air duct.

      One more heatpipe is also designed under graphite sheet in ZTE 5G , When the temperature of the mobile phone rises, the water vapor in the cooling copper pipe will take away the heat along the "vacuum belt". Once the water vapor is cooled and liquefied, it begins to circulate and return along the capillary structure on the wall, so as to keep the CPU at an appropriate temperature and keep the cell phone cooling down.

 Lenovo Savior Pro use double heatpipes +copper plate+thermal grease+graphite sheet to fix thermal issue

Compared to other manufacturer ，Lenovo  adopts five section design in cell phone strecture design;From top to bottom are earpiece, battery, main board, battery, speaker and auxiliary board.The advantage of placing the motherboard in the middle position is that the holding position of both hands during the game can just avoid the hot position of the mobile phone.

Samsung Note 20 use several layers of graphite sheets under the motherboard for heat transportation

Compared to Note10, in Galaxy Note 20 series ,the biggest change is the cooling specification of the motherboard and the material of the back cover.

                    XiaoMi:Three dimensional heat dissipation system

 3000mm2 vapour chamber , 6 layers of graphite sheets,Large amount of copper foil and thermal grease material, combine a three-dimensional and efficient omni-directional heat dissipation system.

iphone11：graphite sheets used for mainly thermal solution 

The graphite sheet (the main board surface, chip, screen and coil) and the firmware developed by Apple are used to solve the heat, and other soaking sheets are not used. When the processor runs at high speed by playing games with the mobile phone, the user will obviously feel the obvious increase in the temperature near the camera and the power on button.