Arieca, A Liquid Metal Embedded Elastomer (LMEE) Technology Company, Received $6.5 Million in Financing

    On May 17th, Arieca Inc., a well-known company in the field of high-performance computing and high-power semiconductor device liquid metal thermal interface materials, received a round A financing of $6.5 million, led by Nissan Chemical Corporation and 412 Venture Fund, with participants including ROHM Co. Ltd., Monozukuri Ventures, Mountain State Capital, Innovation Works, and Carnegie Mellon University. Arieca will use this investment to accelerate product development and expand the manufacturing of its liquid metal based thermal interface materials (TIMs).

    The semiconductor industry is facing severe high-temperature problems. With the further development of the manufacturing industry, microprocessors with node sizes of 7nm, 4nm, or even smaller in the semiconductor roadmap need to accelerate the improvement of packaging technology to compensate for the increasing thermal density in next-generation devices. Arieca is developing a TIM based on liquid metals to provide designers with the excellent thermal conductivity of liquid metals