EOS Collaborates With CoolestDC To Launch A Leak Free Integrated Cold Plate For Server Applications

  EOS, a well-known metal 3D printing product and technology service provider, announced on its official website that EOS, in collaboration with CoolestDC, a subsidiary of the National University of Singapore, has successfully developed the world's first leak free integrated cold plate for server CPUs. EOS stated that finding alternatives to brazed and assembled cold plates to minimize the risk of leakage directly into liquid cooling of chips (DLCs), reduce rack density, reduce power costs, and improve the sustainability of data centers is a consistent goal of the industry.

  Now, EOS applies DMLS technology and high-density copper CuCP process to develop and manufacture integrated cold plates without leakage, gaskets, and joints to create a completely leak free server cold plate liquid cooling solution. The application of a leak free integrated cold plate liquid cooling solution will help reduce the carbon footprint and energy consumption of data centers. Specifically, the performance of IT equipment will be improved by 40%, energy consumption will be reduced by 29% to 45%, carbon footprint will be reduced by 30%, rack space will be reduced by 20%, CAPEX investment (chillers, elevated floor panels, etc.) will be saved by 15%, and cooling water costs will be reduced by $9500/million watts.