Wewynn Integrates Cold Plates With Chip Packaging To Improve Cooling Efficiency

     Wiwynn, a data center IT infrastructure provider, demonstrated its comprehensive data center cooling technology at the 2022 OCP Global Summit, including enhanced air cooling, cold plate liquid cooling, and two-phase immersion cooling solutions. Wiwynn always pays attention to the heat and greenhouse gas impacts of data center systems on the environment, continuously promises to use more renewable energy, and works with supplier partners to promote the application of low-carbon emission technologies. Wiwynn has developed various advanced cooling technologies for data centers to support sustainable development and cope with the continuous growth of next-generation chip power density.

   By integrating cold plates with chip packaging shells to improve thermal efficiency, with the rapid development of advanced technologies such as 3D stacked chips, this innovation will be able to better address the thermal challenges of chip power growth.