Huawei Announces New Inventions For Electronic Devices

     According to the Chinese Patent Announcement Network, the new invention "heat dissipation device, preparation method of heat dissipation device, and electronic equipment" applied for by Huawei Technology Co., Ltd. has been announced recently. The manual points out that with the rapid development of electronic integration technology, electronic devices are becoming increasingly miniaturized. The increasing integration and assembly density of electronic components in electronic devices have not only provided powerful functions, but also led to a sharp increase in their working power consumption and heat generation. Therefore, the heat dissipation demand for electronic components in terminal electronic devices has also increased.

    The manual introduces the preparation method of the heat dissipation device: first, a network structure is formed on the surface of some support columns. Due to the capillary force of the network structure, when the steam of the thermal conductive medium condenses in the condensation area and flows back, it will be adsorbed by the network structure on the support column, and under the action of capillary force, it will accelerate the flow back to the evaporation area.

   This method can improve the reflux speed of the thermal conductive medium in the heat dissipation device of electronic devices such as chips, avoiding the situation where the condensed thermal conductive medium in the evaporation area cannot meet the evaporation requirements, thereby improving the heat dissipation effect of the heat dissipation device and ensuring the heat dissipation performance of electronic devices.