Infinix Announces Self-developed 3D VCC Liquid Cooling Technology

    Recently, Transsion Infinix announced the development of an improved liquid cooling technology called "3D Vapor Cloud Chamber" (3D VCC). According to the company, compared to traditional VC liquid cooling design, it reduces the temperature of the chipset by 3 ° C.
   It is reported that the VC of traditional mobile phones is usually flat and requires the use of thermal grease (or similar materials) to match the chipset and . The Tranvapor chamber ssion Infinix design team has innovatively designed the dimensions of VC shape for the first time, increasing protrusions to enhance the volume, water storage capacity, and heat flux of the evaporator. The 3D VCC leaves a small gap between the chamber and the chipset, increasing the internal volume of the VC, which means it can accommodate more coolant. Experiments have shown that 3D VCC can reduce the temperature of the chipset by 3 ° C and increase heat dissipation speed by 12.5%.