Intel And Submers Launch Immersion Liquid Cooling System

   It is reported that Intel has announced the launch of an immersion liquid cooling system with Submers, called the "Forced Convection Heat Sink (FCHS)," which can cool chips with thermal design power of 1000W or above.

  In this submerged liquid cooling system, two fans are installed at one end of a copper heatsink to enhance the flow of liquid through the heatsink through forced convection. However, the design of this component contradicts the traditional passive concept of submerged cooling  based on natural convection. In addition, this immersion liquid cooling system incorporates features of ease of manufacturing and cost-effectiveness in its design, and some components can also be manufactured using 3D printing to better customize corresponding thermal designs.