Intel LGA4189 Aluminum Tower Fin Heat Pipe CPU Cooler

Aluminum tower zipper fin stack

It's a critical part for ntel LGA4189 aluminum tower fin heat pipe CPU cooler module, the fin stack is manufactured by stamping process to achieve the interlocking fins through tooling die. Aluminum tower fin stack has great heat dissipation performance, when the heat is transported to the fin stack by heat pipes, it enables to dissipate the heat to air rapidly to cool down the CPU or other electronic components. Aluminum fin stack also has cost effective, lightweight, easy manufacturing, etc benefits.

6 heat pipes

This CPU cooler module contains 6 heat pipes to make the heat sink has great thermal conductivity, which can spread and transport the heat generated from CPU or other electronic components very quickly, so the TDP can reach 320W, it's a wonderful thermal solution for high power CPUs. The 6 heat pipes are embeded into the aluminum base and soldered with aluminum tower fin stack and copper block, when the heat generated from the heat source such as CPU is conducted to heat pipes by copper block, the heat would be transported by the heat pipes to the aluminum tower fins rapidly, which makes the temperature of heat source descend quickly to secure the eletronic components from damaging. Heat pipe is the key component for the thermal module.

Re-flow soldering process

The aluminum zipper tower fin, aluminum base, copper block and 6 heat pipes are utilizing re-flow soldering process to combine as a thermal module, The re-flow soldering process offers high precision and tight joint by the soldering fixture and soldering paste, the soldering paste is composed of SN42BI58, which also has good thermal conductivity, the soldering paste melts and fill up the gap between the components during the soldering process, which can significantly decrease the thermal resistance to make the thermal module has excellent thermal performance. Sinda Thermal has two re-flow lines to manufacture the heat pipes soldering heat sinks, we are very experienced in producing these types of heat sinks.

High speed cooling fan

This thermal module is equiped with high speed fan which offers quite, stable, and strong air volume. To maximize the thermal performance, high speed cooling fan is an important device, the forced air can speed up the air flow and blow the heat much faster to the air. When the heat is transported to the aluminum tower fin stack, with the help of forced air of high speed cooling fan, the heat can be blown out quickly to cool down the aluminum fin stack which can significantly improve the heat dissipation of the thermal module. High speed cooling fan is a critical device for the thermal management.