NEOcore Thermal Channel Technology For High-Power Electronic Cooling

    The current power and performance of electronic packaging are increasing, while product size is decreasing. The increase in product power density requires more effective thermal management to achieve good performance and reliability. Research has shown that over 50% of faults in high-power electronic devices are caused by temperature. In the thermal management of power electronics, traditional methods such as aluminum based radiators, heat pipes, or liquid cooling are used. These traditional solutions face many challenges: for example, traditional radiators are bulky, high-performance heat pipes are expensive and difficult to manufacture; Liquid cooling efficiency is high, but its system is complex and expensive, and requires continuous maintenance.

   NEOcore thermal channel technology is based on the two-phase cooling principle, with thermal conductivity 2 to 3 times higher than traditional heat pipes. The thermal conductivity can reach 200'000 W/mK, which is about 1000 times that of aluminum. This technology provides excellent thermal conductivity in lightweight packaging. The CooliBlade cooling system has designed a new phase change technology and structure, creating eye-catching solutions for the cooling of high-power power electronics, including frequency converters, electric vehicles, 5G base stations, smart grids, and LED lighting fixtures.