New Ceramics Are Expected To Be Applied in Electronic Products

       Recently, engineers from Northeastern University in the United States have developed a new type of ceramic material that can be die-cast into complex and lightweight parts, according to CaiAssociated Press. It is said that this breakthrough may open up new applications in the electronic field, including mobile phones, becoming more efficient and durable heat dissipation materials.

     Further research on this ceramic reveals its underlying microstructure, which allows it to quickly transfer heat during the molding process and achieve effective heat flow. Researchers suggest that this ceramic can form exquisite geometric shapes and exhibit excellent mechanical strength and thermal conductivity at room temperature. This Thermoforming ceramic is a new field of materials.

     In the future, this new type of ceramic material can be used for shaping and bonding to various electronic components. This type of ceramic will be thinner, lighter, and more efficient than the metals currently used.