LGA1700 2U Server CPU Heat Sink
LGA1700 2U server CPU heat sink consists of aluminum zipper fin stack, aluminum substract, and 5 heat pipes,which is a high performance heat sink for LGA1700 processors,this design also utilizes heat pipe to conduct the CPU directly which can reduce the thermal resistance and remove the heat from CPU more quickly, when the heat is transported to the aluminum fins, it will be dissipated rapidly with the large air force from the cooling fan, this CPU cooler is designed for high power electronic components, the TDP can reach 240W.
Product Introduction
LGA1700 2U server CPU heat sink consists of aluminum zipper fin stack, aluminum substract, and 5 heat pipes,which is a high performance heat sink for LGA1700 processors,this design also utilizes heat pipe to conduct the CPU directly which can reduce the thermal resistance and remove the heat from CPU more quickly, when the heat is transported to the aluminum fins, it will be dissipated rapidly with the large air force from the cooling fan, this CPU cooler is designed for high power electronic components, the TDP can reach 240W. If you want to learn more about LGA1700 2U server CPU heat sink, please contact us freely.
Product specifications
| Components | Aluminum fin+aluminum base+5 heat pipes | Manufacturing process | Stamping, CNC, soldering |
| CPU socket type | LGA1700 | Surface finish | Nickel plating, passivation |
| Product dimensions | 90.0mm*90.0mm*64.5mm | CPU TDP | 240W |
| Fin thickness | 0.4mm | Server form factor | 2U |
| Fin Pitch | 2.4mm | Certificates | Rohs/CE |
| CPU hole center distance | 78*78mm | Cooling type | Passive |
Product details
Aluminum zipper fin stack
Aluminum zipper fin stack is an ideal air cooled component for high powered forced convection applications for mass production. A zipper fin stack is constructed from a series of individual sheet metal fins that are stamped, folded, and zipped together using interlocking features. Fin lengths and gaps within a stack can vary by using different stamping dies and fins can be closed, creating a finned duct with the zipper fin stack, or open for multi direction air flow depending upon application airflow requirements.
Heat pipe
Heat pipe is a high efficient thermal conductor which even is 1000 times better than a solid copper metal, a heat pipe consists of a copper tube, working fluid, wick structure, the tube is sealed under vacuum condition, then injecting a small amount of working fluid which is usually deionized water, the inner wall is sintered copper powder to form a wick structure. When a heat source such as CPU generates heat, the working fluid vaporizes at the envaporator section, the vapor absorbs the heat and spreads to the other side of the heat pipe by air pressure, at the opposite end which is know as condenser, the vapor releases the heat and returns to the liquid form, with the capillary force of wick structure, it flows back to the envaporator end. Heat pipe is a two phase device by utilizing liquid and vapor phase to spread and transport heat efficiently, it's a crucial component for high power thermal management.
Factory exhibition
Certificates
Recommended products
Thermal design capability
FAQ
1, Q: Are you a manufacturer or trading company?
A: We are a leading heat sink manufacturer in China, our facory has been founded over 8 years and located in Dongguan City, Guangdong province, China.
2, Q: Can you provide ODM or OEM service?
A: Yes, ODM and OEM service is available.
3, Q: Can I print my content in the heat sinks?
A: Yes, we can print the content as customer requsted.
4, Q: Can I visit your factory to audit?
A: Yes, welcome to visit our factory.
Hot Tags: lga1700 2u server cpu heat sink, China, manufacturers, customized, wholesale, buy, bulk, quotation, low price, in stock, free sample, made in China
You Might Also Like
Send Inquiry
