New Nano Thermal Interface Materials Provide Solutions For High-power Devices

     Currently, the functionality of electronic products is rapidly improving, but this inevitably leads to heating problems. Chip heat dissipation has even become an important factor restricting the development of transistor integrated density. There are various active or passive cooling systems or devices in the market, such as heat sinks, heat pipes, etc., to address the issue of chip cooling.
     However, the installation of these cooling devices and chips still relies on the help of thermal interface materials. Otherwise, the presence of a rough interface at the connection between the CPU and the cooling system will result in an increase in thermal conductivity and resistance of the gap.

    At present, commonly used thermal interface materials include thermal conductive adhesive, thermal conductive paste, etc. But it is not enough to adapt to the development of the next generation of high-strength and high-density electronic devices. Based on various new nanomaterials, it can well meet the basic requirements of high thermal conductivity and high mechanical compliance of thermal interface materials. Providing better cooling solutions for high-power and high-performance devices.