TSMC Explores Water Cooling And Heat Dissipation Solution Integrated Water Channel in Chip

      Nowadays，Heat dissipation is a thorny problem for high-performance chips. In addition to the traditional installation of radiators for air cooling, water cooling seems to be a more efficient choice. Industry giants like Microsoft even put data center servers into the sea or immerse equipment in special liquids to improve heat dissipation efficiency.

   With the chip design become more complicate,and the development of process manufacturing technology,tighter process and vertical 3D chip stacking technology make the space between transistors more compressed. How to solve the heat dissipation has become a big problem.

TSMC engineers believe that the future solution is to let water flow between sandwich circuits. It sounds very simple, but it is very difficult to operate in production. And it is still an expensive solution at present compared to traditional air cooling applications.

      Sinda thermal is also work with different customers for future thermal solution technology development, air cooling and traditional liquid cooling are still the mainstream solution for thermal issue. Heat sink products will coexist with heat dissipation all the time in the rapid development of various industries.