News

2 weeks ago, we received an order of 5pcs demand for the gaming computer CPU heatsink from the Swiss customer. Customer wants to get a customized heatsink which can support up to 300W TDP , and he ...

Today , Sinda Thermal team finished the 10pcs tower heatsink for the Spain customer, this is for CPU cooling applications. The heatsink is using aluminum zipper fin stack soldering with 5pcs copper...

2 weeks ago , we received an liquid cold plate order of 5pcs demand from the Austria customer, this is a customized demand for the server liquid cooling applications. Today , we are running the fri...

NVIDIA invented the GPU in 1999. This move has greatly promoted the development of PC game market and redefined modern Computer graphics, High-performance computing and artificial intelligence. The...

Recently, ASUS announced the launch of the new TUF Gaming LC II 360 ARGB liquid-cooled radiator, providing gaming players and high-performance computing users with superior cooling performance and ...

For foldable screen phones, it is necessary to be able to transfer heat from one part of the device to another, where flexible thermal conductive materials play an important role in heat transfer. ...

Sinda thermal production team just received an order of 50pcs demand for the zipper fin soldering heatsink from Japan customer , The heatsink contains an aluminum base, aluminum stamping zipper fin...

Last week, we sent our quotation of the copper vapor chamber CPU heatsink to Turkey customer, customer finally approved the price and released the first 5 pcs demand order to Sinda Thermal . Thanks...

Recently , Sinda Thermal receivd inquiry from the Germany customer for the liquid cold plate, the dimension is 300 x 400 mm.which need to work under at a pressure of 27 MPa/ 270 bar and at a temper...

At the CES 2024 exhibition, MSI showcased a Spatium M580 PCIe 5.0 solid-state drive, with a focus on its use of a liquid cooling system, which resulted in a read speed of 14000MB/s. The Spatium M58...

Due to the high demand for cooling in AI chips and servers, TSMC has recently partnered with hardware manufacturers such as Gaoli, Gigabyte, and Arous to continuously improve in high-speed computin...

In order to effectively address the challenge of continuous growth in AI computing power consumption and ensure stable and efficient operation of computing power in data centers, Lenovo has launche...