Telecom Industry

High temperatures can have harmful effects on the stability, reliability, and lifespan of electronic components. There are often small gaps between electronic components and heat sinks, resulting in a

Skiving fin heat sink is known for its high density and pitch/height ratio in thermal industry.Skiving process is using a cutting tool to bend the fin by the certain pitch which can produce the very t

A VC (vapor chamber )heat sink is a cooling device used to effectively dissipate heat from electronic components or other heat sources. It is a passive thermal management system that operates based on

The power consumed by semiconductors generates heat, which must be removed from the equipment, but how to effectively achieve this is an increasingly challenging task. As the density of transistors in

As the "heart" of the communication system, the 5G communication power supply determines the reliability of the entire system. In order to reduce and maintain cost benefits, improving the heat dissipa

On August 18, 2023, the China Manned Space Engineering Office held a briefing on the application and development of manned space engineering in space. The first liquid metal space thermal management i

As chips iterate towards high density, high integration, and high computing power, their power and power density are constantly soaring, and "high thermal density" has become a major bottleneck in the

The air duct actually refers to the passage of air flow inside the chassis. When designing air ducts, we mainly use the upward movement of hot air to layout from front to back and from bottom to top.

With the rapid development of 5G technology, efficient cooling and thermal management have become important challenges in the design of 5G base stations. In this context, 3D VC technology (3D two-phas

With the development of technology, the vapor chamber heatsink has been widely used in many intelligent terminals. Used in intelligent terminals such as virtual reality (VR) terminals, augmented reali

Most electronic components will heat when current flows through them. Heat depends on power, device characteristics and circuit design. In addition to components, the resistance of electrical connecti

More and more electrical designers are facing the challenges of equipment shape or heat dissipation, but they may not be familiar with the selection range of heat conduction interface materials in the