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06
Mar, 2024
Microchannel Liquid Cooled Plate With Vapor Chamber Thermal SolutionsWith the rapid development of communication technology, the thermal power of electronic devices is also constantly increasing. The power consumption of each evolving generation of products increases b
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26
Feb, 2024
How does 3D VC technology works well in 5G station cooling systemWith the rapid development of 5G technology, efficient cooling and thermal management have become important challenges in the design of 5G base stations. In this context, 3D VC technology (three-dimen
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05
Feb, 2024
How does liquid cooling application in SwitchboardWith the increase of the Internet, cloud computing, and big data services, the total energy consumption of data centers is increasing, and their energy efficiency is also receiving more and more atten
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29
Jan, 2024
Microchannel chip cooling technologyLiquid cooling is the future of data centers. The air cannot handle the power density that reaches the data hall, so a dense fluid with high thermal capacity is flowing into the connection. As the hea
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18
Jan, 2024
Thermal design of liquid cooling switchboardWith the increase of the Internet, cloud computing, and big data services, the total energy consumption of data centers is increasing, and their energy efficiency is also receiving more and more atten
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15
Jan, 2024
Why does 5G require higher thermal performance from electronic devices?With the arrival of the 5G era, electronic device product design is developing towards lightness, intelligence, and multifunctionality. The arrival of the 5G era requires electronic device products to
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Jan, 2024
Vapor Chamber development and applicationWith the emergence and rapid development of the fifth generation mobile communication technology (5G technology), electronic products, especially smartphones, tablets, and other products, are increasi
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02
Jan, 2024
Microchannel Liquid Cooled Plate With Vapor Chamber thermal solutionsWith the rapid development of communication technology, the thermal power of electronic devices is also constantly increasing. The power consumption of each evolving generation of products increases b
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Dec, 2023
Composite Microchannel Liquid Cooled Plate With Vapor Chamber thermal solutionsWith the rapid development of communication technology, the thermal power of electronic devices is also constantly increasing. The power consumption of each evolving generation of products increases b
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20
Dec, 2023
3D VC helps 5G base stations to be lightweight and highly integratedWith the rapid development of 5G technology, efficient cooling and thermal management have become important challenges in the design of 5G base stations. In this context, 3D VC technology (three-dimen
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16
Dec, 2023
The production process of the heatpipeHeat pipe technology appeared as early as 1942, when Perkins invented and improved the thermosyphon (a simple gravity heat pipe). After 1942, Gaugler proposed the principle of modern heat pipes, but i
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23
Nov, 2023
3D VC Technology accelerate the 5G base station developmentWith the rapid development of 5G technology, efficient cooling and thermal management have become important challenges in the design of 5G base stations. In this context, 3D VC technology (3D two-phas
