Vapour Chamber Liquild Cooling
Vapour Chamber Liquid Cooling is technically similar to heatpipe in working principle, but still have some difference in thermal conduction mode.
Product Introduction
Vapour Chamber Liquid Cooling is technically similar to heatpipe in working principle, but still have some difference in thermal conduction mode.
The heatpipe is one phase thermal solution while Vapour Chamber Liquid cooling is two phase thermal solution, so the Vapour Chamber efficiency is higher.
Vapour Chamber can be integrated with either aluminum or copper heatsinks, this combination makes a new micro liquid cooling system.
The simplest method is to solder a vapor chamber to the base of an extruded heatsink. A more thermally efficient method is to solder a stack of stamped fins directly to the surface of a vapor chamber. To improve the dimensional integrity, these fins are often interconnected by locking tabs called zipper fins.
Benefits & Advantages:
1. Low thermal resistance, Rca can lower to 0.05℃/W under 300W power input with 30mm*30mm heat source size.
2. Flexible design for any size and shape with different applications required.
3. Increase more thermal performance in limit designed space.
4. Maintain Devices cooler by alleviating spreading resistance.
Specifications:
With the development of technology and manufacturing process improved, vapour chamber liquid cooling is now more and more used in different areas, such as, gaming device, CPU, GPU, notebook, smart phone, telecom device, lightning applications.
Below specifications are just for technical reference only, please contact Sinda Thermal engineer for your customized design.
Application | Power | Size L x W (mm) | Thickness (mm) | Material |
Gaming console | 150 - 250W | 150 x 150 | 3 – 5 | Cu |
Telecom Base Station | 50 - 100W | 100 x 100 | 2 – 4 | Cu/Cu alloy |
Graphics Card | 200 - 350W | 220 x 90 | 2 – 4 | Cu/Ti |
Server | 200 - 400W | 80 x 150 | 3 – 4 | Cu |
Inverter (IGBT) | 500 - 2000W | 450 x 450 | 3 – 8 | Cu |
Laptop | 15-25W | 220 x 60 | 0.5 | Cu alloy |
Mobile Phone | 5W | 80 x 50 | 0.3 - 0.4 | Cu alloy |
Mobile Phone | 5W | 80 x 50 | 0.4 | Stainless Steel |
Applications:
CPU & GPU
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Latop & Smart Phone:
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Lightning:
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Vapour Chamber Process Review:
FAQ:
Q: What is the expected tooling cost for a new design.
A: The tooling cost is dependent on product size and downstream additions of components to the assembly.
Q: What is the lead-time?
A: Usually, 2 weeks design, 4 weeks proto, 8 weeks tooling.
Q: What test will be included before shipping?
A: Thermal Cycling & Thermal Shock, Shock & Vibration Testing, Packaging Drop Testing, etc, according to customers’ requirement.
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