Development trend of heat pipe and vapor chamber industry

    With the continuous promotion of 5G construction, 5G base stations and servers will carry massive data processing and transmission requirements. The increase in working power consumption has made the heat dissipation problem very prominent. At the same time, with the continuous development of electronic terminal products towards lightweight and multifunctional trends, the heat generation and heat dissipation needs of various internal components of electronic products have also significantly increased.

   At present, with excellent thermal conductivity, the penetration rate of heat pipes and temperature equalization plates in various electronic terminal products such as 5G communication devices, servers, smartphones, laptops, projectors, etc. is constantly increasing. In the future, the related market space is expected to continue to expand.

     With the increasing lightness and thinness of electronic products, the internal space of products is becoming smaller and the integration of internal components is becoming higher. Thermal conductive and heat dissipation materials or components need to achieve more efficient thermal conductive and heat dissipation functions in a narrow physical space. Thermal conductive and heat dissipation enterprises are required to continuously improve their existing technological level in order to develop higher performance and precision  thermal products.

   Comparing the thermal conductivity of different materials, it was found that the thermal conductivity of heat pipes and vapor chamber  is nearly ten times that of graphite materials. Among heat pipes and  vapor chamber s, the thermal conductivity of uniform plates is higher. Therefore, the advantages of heat pipes and uniform temperature plates vapor chamber  are more obvious. I n addition, heat pipes belong to one-dimensional linear heat conduction, while vacuum chamber heat plates provide two-dimensional conduction space, resulting in higher efficiency. Specifically, heat is absorbed by the liquid at the bottom of the vapor chamber, then evaporated and diffused into the vacuum chamber, conducting the heat to the heat sink, and then condensed into a liquid back to the bottom. This heat dissipation principle is similar to the evaporation and condensation process of refrigerator air conditioning.

     In the future, with the emergence of high-power products and the digital transformation of the industry, the demand for high-efficiency heat pipes and vapor chamber  in the market will significantly increase, and more production requirements will also be put forward. This will promote the upgrading of thermal  products towards higher quality and efficiency, which is conducive to the healthy and healthy development of the industry.