DLP projector cooling solutions
From the perspective of heat dissipation, the feature of DLP technology is that its imaging elements have a low impact on the brightness of the projection light source. Compared with LCD technology, if the same projection brightness is achieved in the same environment, the power requirements of the bulb can be lower, so that the heat generation of the bulb can be reduced, so as to reduce the heat generation of the whole system.
Because of the reduced power requirements for the bulb, the thermal design on the DLP projector is simple, which is also an important reason why most DLP projectors are designed to be small and portable. Because the heat dissipation design is simple, it can be handled even if the internal structure is compact, and the design is small and easy to realize.
It can be seen from the internal structure that the internal structure of the projector designed by DLP is very regular. Obviously, this structure is considered for heat dissipation after the existing circuit design. In the whole projector structure, we found a total of three fans for active heat dissipation. Among them, the fans dedicated to heat dissipation for the bulb are composed of two. One position is next to the bulb, which provides air flow to the bulb from the position inside the chassis, and the high-temperature air flow passing through the bulb is discharged from the front side of the projector. A small turbine fan is also designed next to the main fan. Viewed from the structure, the fan mainly forms an air duct to provide cooling air outside the chassis for the main fan.
The other fan is less visible and is located next to the light path. The fan plays two roles at the same time: one is to actively heat the optical path structure that may have high temperature in order to avoid damage to nearby components, especially DLP imaging elements, caused by the high temperature generated by the bulb transmitted to the metal shell of the optical path on the optical path; In addition, the fan can also isolate the high temperature from the circuit part to ensure the safety of the circuit.
The heat generation of DLP imaging element itself is not high, and its thermal design in the projector is also relatively simple. From the figure, we can see that the heat dissipation requirements can be met by conducting heat with the help of metal film and relying on the passive heat dissipation of the projector shell.
