Intel LGA 1700 Copper Skived Fin CPU Cooler
Heat sink type:CPU cooler;
Components:Copper skived fin heat sink+fan;
Application:LGA 1700 CPU socket.
Product Introduction
Intel LGA 1700 copper skived fin CPU cooler is designed for Intel 1U server CPU, socket LGA 1700, this CPU cooler type consists of copper skived fin heat sink and high speed fan, the heat sink utilizes skiving process to slice the sheets from a copper base and bend to form a copper fin, the fins interlock with each other. Due to the fins are peeled from the copper base, the thermal resistance between the fins and base is very low, so the heat can be conducted to the fins very soon, with the help of high speed fan, the forced air blows the heat to the environment rapidly. Intel LGA 1700 copper skived fin CPU cooler has excellent heat conduction and heat dissipation performance, the TDP can reach 125W, it's a classical thermal solution for 1U server CPUs.
Product Specification
| Component | Copper skived fin heat sink+fan | Fan connector | 4pin PWM |
| CPU type | LGA 1700(square motherboard) | Bearing type | Two ball bearing |
| Voltage rating | 12V | CPU TDP | 125W |
| Product dimensions | 90mm*89mm*27mm | CPU hole center distance | 78mm*78mm |
| Fan speed | PWM 1500-6600RPM | Manufacturing process | Skiving process |
| Noise level | 64.00dBA (MAX) | Certificates | Rohs and REACH compliant |
| Air flow volume | 21.35CFM (MAX) | Application | LGA 1700 CPU socket |
Product details
 Copper skived fin heat sink A copper skived fin heat sink offers maximum thermal performance in a given space, compared with other manufacturing process, skiving technique offers thinner fins, denser fin pitch and high aspect ratio which provides more heat dissipation area, and due to the skived fins are sliced from the base, so the thermal resistance between the fin and base is very low, which makes the heat sink has great thermal conductivity. The thermal conductivity of copper is ~400W/m-k, which is best conductor of heat in all the commercial metals, so a copper skived fin heat sink can remove the heat from the CPU rapidly and dissipate to the air quickly. it is a great thermal solution for CPUs and other electronic components. |
 High speed cooling fan A cooling fan is a key component for a CPU cooler, to improve the heat dissipation performance, a cooling fan is essential to provide strong air flow to blow the heat out. When the heat is conducted by the heat sink copper base and transported to the fins, we need to dissipate the heat to air as fast as possible to improve the thermal performance, reinforce the air flow to make the heat can be dissipated faster, so a high speed cooling fan is the perfect option, which is an active cooling method to offer strong air flow. with the help of cooling fan, the heat in the skived fins can be dispersed to the air quickly, so the thermal performance of CPU cooler is significantly improved. |
Factory exhibition
Certificates
FAQ:
1, Q: Are you a manufacturer or trading company?
A: We are a leading heat sink manufacturer in China, our facory has been founded over 8 years and located in Dongguan City, Guangdong province, China.
2, Q: Can you provide ODM or OEM service?
A: Yes, ODM and OEM service is available.
3, Q: Can I print my content in the heat sinks?
A: Yes, we can print the content as customer requsted.
4, Q: Can I visit your factory to audit?
A: Yes, welcome to visit our factory.
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