Heat Pipes & Vapor Chambers – What’s the Difference?

       Most servers for data and telecommunication systems use air to cool the high-power chips inside. As the power level of these chips keep increasing, the pressure is on thermal engineers to design ever higher performance air-cooling heat sinks. In recent years, advancements in manufacturing of thinner heat pipes and vapor chambers have enabled engineers to integrate the heat pipes and vapor chambers into the blade server heat sinks.So what's the difference of Heat Pipes & Vapor Chambers? 

     A heat pipe is a self-driven two-phase heat transfer device.  At the hot section (evaporator), the liquid evaporates and turns to vapor. The vapor flows to the cold section (condenser) and liquefies there. The liquid is driven back from the cold section to the hot section by a capillary force induced by the wick structure. By using boiling and condensation, the heat pipes can transfer and spread the heat from one side to another side with a minimum temperature gradient.

      Vapor chambers are flat heat pipes with very high thermal conductance. They have flat surfaces on the top and bottom sides.  See Figure 2, which can be easily attached to a heat source and a heat sink.

Structural Design & Cost:

    In electronics cooling, heat pipes are generally used to move the heat from electronics to heat dissipation devices,while Vapor chambers are generally used to spread heat from a small size device to a larger size heat sink.

     Sinda Thermal is a thermal product provider  specializing in heat sink for servers,computer CPU,medical equipment,telecom device,electric vehicle,etc.we have expreienced and professional engineering team to provide customer with suitable thermal solutions based on their applications fields. Please feel free to contact if you have any needs.

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