How to solve the heat dissipation and electromagnetic interference problems faced by 5G base stations?

        In the current era, 5G is almost everywhere, from electronics manufacturers to consumers, hoping to have the ability to transmit more data more accurately and faster than ever before. The very direct application of 5G technology is in base stations, which will send signals for fixed wireless access.        

        5G base stations use the millimeter wave range, have a large amount of bandwidth available, higher data transmission speed, support for high bandwidth, and requirements based on 5G infrastructure systems to provide lower latency, which push the equipment to very high performance.       

        5G base stations use multiple input and output antennas to promote spatial multiplexing, which means that the antennas send signals directly to users, avoiding common cellular network overload problems. However, all these millimeter wave multi-input and output arrays that require a large number of antennas usually use 64 or 128 elements, each of which requires its own power amplifier and analog-to-digital converter, and all of these are in a very compact space. Inside, these tightly packaged electronic devices generate a lot of heat, so a powerful heat dissipation system is very important.        

        Especially in the outdoor environment where active heat dissipation is limited, thermal interface materials have become an indispensable reliability material in the 5G industry. It is recommended to use thermally conductive silicone sheets and thermally conductive gels to connect thermal integrated circuits and cooling components, but if the heat dissipation components Too close to the antenna will cause electromagnetic interference problems. At this time, it is necessary to use thermally conductive absorbing materials to increase the anti-interference performance. Only by effectively solving the problems of heat dissipation and electromagnetic interference can reliable hardware be produced. 

        Product characteristics of thermally conductive absorbing materials: 

        1. Soft and thin, easy to process and cut; 

        2. It can correspond to diversified sizes and shapes;

        3. High temperature resistance and good flexibility;

        4. Halogen-free and lead-free, meeting RoHs directive; 

        5. It needs to be bonded or pressed on the metal bottom plate to achieve a good wave absorbing effect;

        6. Easy to use and can be installed in a small space.