Knowledge about thermal interface materials
As the size of the chip decreases, the integration level and the power density continue to increase, more and more heat is generated during the operation of the chip, which causes the temperature of the chip to continue to rise, which seriously affects the performance, reliability and life of the final electronic components. Thermal interface materials are widely used in the field of heat dissipation of electronic components. Its main function is to fill between the chip and the heat sink and between the heat sink and the heat sink to expel the air in it, so that the heat generated by the chip can pass through the thermal interface more quickly.
The material is transferred to the outside to achieve the important role of lowering the working temperature and prolonging the service life. This article reviews the industry status and latest research progress of thermal interface materials. The industry status section introduces the output and market share of thermal interface materials, the demand for the main application fields of thermal interface materials, the application of thermal interface materials in communications and other fields, and the market analysis of thermal interface materials. The research progress section introduces the research work of researchers in improving the thermal conductivity of thermal interface materials in recent years, including the research progress of filled polymer composites and intrinsic thermally conductive polymers.
Thermal interface materials (TIMs) are widely used in the field of heat dissipation of electronic components. They can be filled between the electronic components and the heat sink to expel the air therein, so that the heat generated by the electronic components can be transferred through the thermal interface materials more quickly To the radiator, it achieves the important role of lowering the working temperature and prolonging the service life.
Thermal interface materials are generally used in the solid interface between integrated circuits (chips) or microprocessors and heat sinks or heat spreaders, as well as between heat spreaders and heat spreaders (as shown in Figure 1). As the chip size becomes thinner, the integration level and the power density continue to increase, the heat accumulated inside the chip increases sharply, which seriously affects the chip's operating speed, performance stability, and ultimate lifespan. In 2016, "Nature" published a cover article stating that "Due to the ‘heat death’ caused by the continued miniaturization of electronic devices, the upcoming international semiconductor technology map no longer targets Moore’s Law." Since there are a large number of gaps between the chip and the heat sink and between the heat sink and the heat sink, the gap is filled with air. However, it is well known that air is a poor conductor of heat. The thermal interface material fills the gaps between the chip and the heat sink and between the heat sink and the heat sink, and establishes a heat conduction channel between the chip and the heat sink, and realizes the rapid heat transfer of the chip.
In the face of fierce competition, my country has also paid full attention to it at the national level. Table 1 summarizes the relevant policies for basic research and technology development of thermal interface materials issued by my country. The Ministry of Science and Technology of the People's Republic of China deployed in 2008 and launched the 02 major special project (very large-scale integrated circuit process and equipment) in 2009. The IC fund was launched in 2014. After nearly ten years of support, my country's integrated circuit industry has made considerable progress. Development, the packaging and testing industry ranks among the top three in the world. However, high-end electronic packaging materials, which are the material basis, still basically rely on imports. Thermal interface materials are widely used in electronics and other industries, and the state has also issued relevant support policies to promote the development of the domestic thermal interface materials industry. For example, in 2016, the Ministry of Science and Technology launched the "Strategic Advanced Electronic Materials" special project and laid out "High-power density electronic device thermal management materials and applications". One of the research directions is "High-performance thermal management for high-power density thermal management." Interface materials".
With the increasing requirements for safe heat dissipation in microelectronic products, thermal interface materials are also constantly developing. From the initial thermal grease, it has developed into a variety of categories such as thermal pads, thermal gels, thermal phase change materials, thermal adhesives, thermal tapes, and liquid metals. Traditional polymer-based thermal interface materials account for nearly 90% of all products, while liquid metal thermal interface materials account for a relatively small proportion, but their share is gradually expanding.
