MSI Graphics Card thermal solution

     This year's Nvidia RTX 40 series graphics card can be said to have taken the lead, especially the RTX 4090, which is currently the invincible version. However, the biggest impression of this graphics card is the huge heat sink. Except for the liquid cooling heat sink, other manufacturers' graphics cards start with almost three slots, and some even reach the level of four slots,
     However, after actual testing, it was found that the redundancy provided by the heat sink was too large and a bit wasteful. At the Taipei Computer Show, some manufacturers even need to introduce larger heat sinks to achieve higher thermal performance. Perhaps they believe that future graphics cards will have higher heat dissipation performance compared to RTX 4090 graphics cards.

    At the Taipei Computer Show, MSI has showcased a heat sink mold based on the next generation graphics card. This heat sink mold uses dynamic bimetallic fins, six through pure copper heat pipes, and other processes to enhance the heat dissipation capacity of the entire graphics card. Of course, considering that there is no content for the next generation graphics card yet, RTX 4090 graphics card is still used as the substrate, However, MSI clearly stated that this heat sink is specifically designed for the next generation flagship graphics card, and if not unexpected, it will be the RTX 5090 graphics card. Of course, the volume of this heat sink is also very terrifying, reaching 4.2 slots, and basically there is no hope of placing it in the ITX chassis.

    According to previously disclosed information, the RTX 5090 will be based on the Blackwell architecture with 18432 CUDAs, using TSMC's 3nm process technology, with an L2 cache of 96MB, and graphics memory using GDDR7. It is expected that the performance will be 1-1.6 times higher than the current RTX 4090.