Serval ways to enhance the thermal cooling performance

    The basic law of heat transfer is that heat is transferred from high-temperature area to low-temperature area. There are three main ways of heat transfer: conduction, convection and radiation. 

The thermal design of electronic products can enhance heat dissipation in the following ways:

1. Increase the effective heat dissipation area: the larger the heat dissipation area, the more heat is taken away.

2. Increase the wind speed of forced air cooling and the convective heat transfer coefficient on the object surface.

3. Reduce the contact thermal resistance: applying thermal conductive silicone grease or filling thermal conductive gasket between the chip and the heatsink can effectively reduce the contact thermal resistance of the contact surface. This method is the most common in electronic products.

4. Breaking the laminar boundary layer on the solid surface increases the turbulence. Because the solid wall velocity is 0, a flowing boundary layer is formed on the wall. The concave convex irregular surface can effectively destroy the laminar boundary of the wall and enhance convective heat transfer.

5. Reduce the thermal resistance of the thermal circuit: because the thermal conductivity of the air is relatively small, the air in the narrow space is easy to form thermal blockage, so the thermal resistance is large. If the insulating heat conductive gasket is filled between the device and the chassis shell, the thermal resistance is bound to be reduced, which is conducive to its heat dissipation.

6. Increase the emissivity of the inner and outer surface of the shell and the surface of the heatsink: for a closed electronic chassis with natural convection, when the oxidation treatment of the inner and outer surface of the shell is better than that of the non oxidation treatment, the temperature rise of the components decreases by an average of 10%.