The application of Thermal Conductive Ceramic Gasket
Thermal conductive ceramic gasket is a material with high thermal conductivity. It is mainly composed of alumina (alumina content is more than 96%), with pure white appearance and hard texture. It is mainly used for heat transfer and electrical isolation between power devices and heatsinks.
The thermal conductive ceramic gasket has excellent sealing performance after it is closely combined with power devices (such as power MOS tube, power triode, etc.), aluminum heatsink and PCB board. It can achieve the ideal effects of dust prevention, waterproof, thermal conductivity and insulation, adapt to the harsh working environment of high temperature, high pressure and dust, and improve the safety and stability of equipment operation.
Advantages and Benefits:
The thermal conductivity of ceramic gasket is as high as 20 W / (m-k) ~ 30W / (m-k), which is much higher than that of ordinary thermal conductive gasket. Therefore, it has been widely used under the very harsh heat dissipation requirements of power devices. At present, the thermal conductivity of thermal conductive gasket is mostly lower than 3.5 w / (m-k).
The breakdown strength of ceramic gasket is 10kV ~ 12kV, and the maximum allowable temperature is 1600 ℃. It can adapt to the harsh working environment of high temperature, high pressure, high wear and strong corrosion, and meet the application requirements of power products in various occasions.
Long service life. It can reduce the number of equipment maintenance and improve the safety and stability of equipment operation.
The ceramic gasket is used as the thermal conduction material between the power device and the heatsink, which has high heat conduction efficiency, high temperature / high pressure resistance, uniform heating, fast heat dissipation, simple and compact structure, and has a wide application prospect in high-power power products.
