The applicaton of thermal material in 5G thermal management
A remarkable feature of the 5G era is the significant increase in calorific value. With the increase of power consumption of electronic equipment, the requirements for heat dissipation are more stringent, and heat conduction and heat dissipation materials are more widely used.
Thermal conductive material is the auxiliary material of electronic products, which plays a role in solving the heat dissipation problem of electronic products, so as to improve the running speed, reliability, stability and service life of electronic products. It is an indispensable part of electronic products.
Thermal conductive silica gel sheet:
The thermal conductivity can reach 3-7w / MK and maintain good elasticity. It can be used to cover the uneven or irregular device surface and fully fill the gap between the heat sink or metal shell during heating. Make the heat transfer to the radiator more effectively, so as to provide the operation efficiency and service life of the device.
Thermal conductive silicone cloth:
It is a highly plastic silica gel heat conduction product. Products with different thermal conductivity can be selected according to customers' use. The heat conduction mud does not flow or layer, and has good interface wettability. The thickness of the minimum flattening gap can reach 0.12mm. The application process can be made into sheet products with high compressibility or rubber mud by hand according to customers' needs, It has high thermal conductivity and excellent caulking effect.
Thermal Grease:
It has low viscosity and excellent thermal conductivity. It can make the surface of electronic components to be cooled close contact with the radiator, reduce the thermal resistance, and quickly and effectively reduce the temperature of electronic components, so as to prolong the service life of electronic components and improve their reliability.
Single component hot glue:
Heat conducting silica gel made of special heat conducting materials is added to form a flexible rubber body after curing. Alcohol substances are released during the curing process, which has no corrosion to polycarbonate (PC), copper and other materials. It has good bonding and sealing performance to most materials, and protects electronic products under severe conditions in a stable state.
Thermal conductive potting adhesive：
It has low odor, low VOC, wide process operability and high physical properties of finished products. It is suitable for machine dispensing or manual mixing; After curing, it has good adhesion, strong adhesive force, excellent thermal conductivity, aging resistance and chemical resistance. It is suitable for sealing and bonding of metal, plastic, rubber, polyester and other materials.
