5G Heatsink design for AAU base station
5th generation mobile networks is a newly mobile communication technology , working as the extention generation of 4G system, the performance objectives of 5g are high data rate, reduced latency, energy saving, cost reduction, improved system capacity and large-scale equipment connection.
With the continuous development of mobile communication services, a large amount of data needs to be processed, and the transmission rate needs to be doubled. The power consumption of BBU and AUU of 5G base station will gradually increase. The power consumption of 5G base station has reached 2.5 ~ 3.5 times that of 4G base station. The increase of AUU power consumption is the main reason for the increase of 5G power consumption.
The increase of power consumption has brought about the thermal problem. To fundamentally solve the heat dissipation problem of 5G base station, we need to start from the following aspects:
1. Research and development of high thermal conductivity materials and reducing contact thermal resistance:
The application of high thermal conductivity materials can transfer the heat generated by 5G heating parts to the low-temperature area in time, so as to achieve heat balance and improve the service life and stability of the equipment.
2. Reduce surface temperature of shell:
Since most 5G devices are set outdoors, the temperature of the shell will become very high under the sun and high load during the day, especially in summer. By using the metal shell with high-density heat dissipation fin, the heat dissipation speed of its surface can be accelerated, so as to reduce the shell temperature.
3. Reduce the temperature between chip and shell:
The heat output from the chip can not be ignored. If the chip temperature is too high, it will often lead to system strike. Use high-performance thermal module to contact with the chip to cool the device chip in time.
4.Improve temperature uniformity:
A hign thermal conductive material ,such as carbon fiber thermal PAD , and other hign performace thermal modules like vapor chamber heatsink , hi-contact heatpipe cooler ,will help to improve the temperature uniformity of the whole device.
5. liquid cooling way:
Liquid cooling system is now also widely used in 5G technology , it's a high efficiency solution for high power consumption device.
With the continuous development of 5G technology, the power requirements of equipment will be higher and higher, which also leads to the design of thermal solution becoming more and more important. Therefore, a good thermal solution plays a key role in the sustainable development of 5G new technology.
