Will the vapor chamber become the main stream thermal solution for cell phone in the future?
With the continuous improvement of chip power density, vapor chamber has been widely used in the heat dissipation of high-power devices such as CPU, NP, ASIC and so on.
In terms of conduction mode, the heat pipe is one-dimensional linear heat conduction, while the vapor chamber conducts heat on a two-dimensional plane. Compared with the heat pipe, firstly, the contact area between the vapor chamber and the heat source and heat dissipation medium is larger, which can make the surface temperature more uniform; Secondly, the use of vapor chamber can make the heat source directly contact with the equipment and reduce the thermal resistance, while the heat pipe needs to be embedded in the substrate between the heat source and the heat pipe.
The vapor chamber assembly has a larger area, which can better reduce hot spots and realize the isothermal under the chip. It has greater performance advantages compared with the heat pipe assemblies . At the same time, the average temperature plate is also lighter and thinner. It not only absorbs and dissipates heat quickly, but also conforms to the current development trend of lighter and thinner mobile phones and maximized space utilization.
Vapor Chamber has a wide range of applications. It is especially suitable for the heat dissipation demand in the narrow space environment where the height space is strictly limited. Such as notebook computers, computer workstations , cell phones and network servers. With the trend of lightweight downstream consumer electronics, the demand for vapor chamber is expected to increase.
Sinda Thermal has rich experience in providing thermal solution design for various applications for customer. We can provide varieties heatsinks and coolers which inlcuding aluminum extruded heatsink, high performance heatsink, copper heatsink, skived fin heatsink, liquid cooling plate and heat pipe heatsink. please contact us if you have any questions about thermal solution.
