The thermal solution for Telecommunication equipment

  The world is in the process of digitization, networking and intelligentization, in which "the cyber information world, the natural world and human society" are deeply integrated.  This process is profoundly changing the competition, security, economic, social, military and cultural landscape of the world. It has brought new opportunities for national development, new space for people's lives, new areas for social governance, new driving forces for industrial upgrading and new frontiers for international competition.

  The overall development trend of network communication technology presents ten characteristics: network, architecture, connection, space, software, data, bandwidth, virtual, digital and micro. In the next few years, P-bit optical fiber transmission, E-bit switching and gigabit + access will gradually become reality.

  Telecommunication equipment cooling solution

  In terms of hardware cooling, most manufacturers used to solve the thermal problem in the past to increase the space in the structure, open up the cooling holes, increase the volume of the radiator, and use the cooling fan to force the air flow cooling. With the miniaturization of the equipment and the popularity of the aesthetics, the main frequency of the chip is getting higher and higher, the bandwidth is getting larger and larger, the transmission speed is faster, The heat of network communication equipment rapidly gathers in a short time after starting up, which requires a better thermal solution to deal with.

  With the power of the electronic components is increasing, the traditional heat sink like aluminum extruded heat sink could no satisfy the thermal requirements, and the internal space of the telecommunicate equipment is limited, so we need to design a heat sink which can conduct the heat from the device and dissipate it rapdily. For Telecommunication equipment, the most widespread heat sink type is air cooling, and the heat sink is composed of heat pipes or vapor chamber and aluminum fins. which have great thermal conductivity and heat dissipation performance, in the rated space, the heat pipe heat sink or vapor chamber heat sink can be designed to solve the thermal issue of high power telecommunication equipment.