Thermosyphon CPU Cooler

Product Description:

Thermosiphons are passive, two-phase thermal management components or systems that do not require mechanical pumps or other moving parts within the fluid loop. As they rely on gravity to return condensed fluid to the evaporator, Thermosiphons do not require any added electrical power to operate, making them more reliable than active cooling liquid loops in stationary applications. With the right design, thermosiphons can also help you reduce thermal management weight and volume by increasing overall system performance.

Usually, there are 4 categories of thermosiphon solutions, Vertical Source to Air Thermosiphons, Horizontal Remote Cooling Assemblies, Air to Air Heat Exchangers, and Two-Phase Enhanced Fins.

Benefits:

1. Transport Distance over >200 mm distances.

2. Reduce Interface Resistance between devices and Thermosiphons with Thermal Interface Materials

3. CPU TDP designed support from 200W-500W.

4. Multiple chip temperatures can be maintained within < 2°C

Sample Pictures:

FAQ:

Q: Is this standard part or customized part?

A: Since thermosiphon has complex structure, parts are 100% customized.

Q: What’s the lead time?

A: Normal sample lead time is 8 weeks.

Q: How can I know more about this product process?

A: Contact with our engineer, we can share more detailed file to you.

Q: How to get a quotation?

A: Send us your specification, we will quote to you in 48 hours after all information confirmed.

Q: What’s the payment term?

A: T/T in advance is preferred, other term can be negotiated

Q: From which port you arrange shipment, and how long it takes before I receive?

A: We ship from HongKong or ShenZhen, China, normal delivery time is 3-5 days for erpress air shipment, depends on your destination.

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