What cooling technology does a mobile phone usually use
In recent years, with the stable development of intelligent technology, intelligent manufacturing has become the focus of many product R & D. promoting intelligent manufacturing technology can effectively improve the work efficiency of products and reduce their operation cost. Therefore, in terms of mobile phone heatsink, we can find some breakthrough points for upgrading, such as using specific devices to realize intelligent temperature control. After smart phones enter the 5g era, With the increasing use frequency of mobile phones, their accessories will bear greater use pressure. Therefore, we should try our best to eliminate the influence of external factors to prolong the service life of mobile phones.
Currently, many smart phones use a large graphite cooling sheet to assist in processing chips and other heat generated to dissipate heat. Because there are many small grains in graphite, after covering them on the circuit board, they will distribute the heat emitted throughout the body, thereby reducing the generation of heat. Correspondingly, most mobile phones that use this technology will design a layer of metal thermal conductive plate inside the shell, which will directly transfer the heat generated by the thermal conductive graphite to the metal corners of the phone through the metal plate, with good heat dissipation. The conductivity of metals achieves the effect of heat dissipation.
In addition, some mobile phones will use thermal conductive gel to coat the mobile phone CPU to assist in heat dissipation. The thermal conductive gel has a similar heat dissipation principle to that of thermal conductive graphite, which reduces heat generation by applying thermal conductive materials to related equipment. Due to its excellent thermal conductivity, high temperature resistance, and insulation properties of thermal conductive adhesive, it has become an ideal heat dissipation material.
In recent years, emerging "gaming phones" and "esports phones" have used this technology. There is a hollow tube built-in in the phone, and it is filled with heat dissipation auxiliary liquid with good thermal conductivity. When the component is heated, the heat dissipation auxiliary liquid in the pipeline will evaporate. As evaporation proceeds, steam flows towards the condensation section of the heat pipe under a slight pressure difference. Steam releases heat in the condensation section and then condenses into a liquid, which flows back to the evaporation section along the porous material through capillary forces. Repeat this cycle to achieve heat transfer.
After heat pipe cooling, vapor chamber technology has been widely used in medium and high-end mobile phones. Its biggest advantage is thin, because mobile phones have higher and higher requirements for internal space. At present, 0.3mm ultra-thin VC has been successfully applied to mobile phones and has reached a stable process level of mass production. Compared with laying copper mesh or copper powder sintered capillary core structure, a 0.3mm ultra-thin vapor chamner is developed by using the precision etching microstructure integrated capillary core process, which reduces the overall thickness by about 50um, which not only simplifies the process, but also reduces the cost, making it possible for the VC soaking plate to enter 5g medium and low-end mobile phones.
No matter what kind of thermal material and thermal cooling method is used, its purpose is to reduce the working temperature of the equipment and improve the stability. To improve the heat dissipation problem, both hardware and software need to be improved to produce synergy.
