Copper Vapor Chamner Heatsink Inquiry From US Customer

     Yesterday  ,Sinda Thermal engineer team received an inquiry for the copper vapor chamber CPU heatsink from US customer, the heatsink design contains a copper vapor chamber, and a copper zipper fin ,which needs to support 250W TDP for server CPU cooling applications.We are working on the cost analysis and will update the quotation to customer soon.

    Vapor Chambers are flat thermal solutions used in place of heat spreaders to evenly and more efficiently diffuse heat from a source to a larger platform of area. The heat source outputs heat onto the vapor chamber, and the heat input vaporizes the working fluid inside the chamber, spreading to the entire inner volume, condensing over a large surface, cooling the vapor rapidly and transforming the vapor back to liquid. The liquid is transported back to the heat source via the structured lining the inner wall of the chamber.